DocumentCode
2146395
Title
Thermal-aware lifetime reliability in multicore systems
Author
Wang, Shengquan ; Chen, Jian-Jia
Author_Institution
Dept. of Comput. & Inf. Sci., Univ. of Michigan-Dearborn, Dearborn, MI, USA
fYear
2010
fDate
22-24 March 2010
Firstpage
399
Lastpage
405
Abstract
As the power density of modern electronic circuits increases dramatically, systems are prone to overheating. High temperatures not only raise packaging costs, degrade system performance, and increase leakage power consumption, but also reduce the system reliability. Due to many limits in single core design including the performance and the power density, the microprocessor industry has switched their attentions to multicore design to enable the scaling of performance. Thermal effects on multicore systems are still prominent issues. One typical thermal effect is the thermal-aware lifetime reliability, which has become a serious concern. In this paper, we address the issue on how to maximize the lifetime of multicore systems while maintaining a given aggregate processor speed. By applying sequential quadratic programming, we present how to derive the ideal speed for each core to maximize the system lifetime. We perform experiments on several multi-core platforms, which show that the proposed method can significantly outperform the existing approaches by minimizing the peak temperature of the system.
Keywords
logic design; microprocessor chips; multiprocessing systems; power consumption; quadratic programming; semiconductor device reliability; thermal variables measurement; aggregate processor speed; leakage power consumption; microprocessor industry; modern electronic circuits; multicore systems; packaging costs; sequential quadratic programming; single core design; thermal aware lifetime reliability; Costs; Electronic circuits; Electronic packaging thermal management; Energy consumption; Microprocessors; Multicore processing; Power system reliability; System performance; Temperature; Thermal degradation; multicore systems; reliability; thermal-aware issues;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2010 11th International Symposium on
Conference_Location
San Jose, CA
ISSN
1948-3287
Print_ISBN
978-1-4244-6454-8
Type
conf
DOI
10.1109/ISQED.2010.5450548
Filename
5450548
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