• DocumentCode
    2146395
  • Title

    Thermal-aware lifetime reliability in multicore systems

  • Author

    Wang, Shengquan ; Chen, Jian-Jia

  • Author_Institution
    Dept. of Comput. & Inf. Sci., Univ. of Michigan-Dearborn, Dearborn, MI, USA
  • fYear
    2010
  • fDate
    22-24 March 2010
  • Firstpage
    399
  • Lastpage
    405
  • Abstract
    As the power density of modern electronic circuits increases dramatically, systems are prone to overheating. High temperatures not only raise packaging costs, degrade system performance, and increase leakage power consumption, but also reduce the system reliability. Due to many limits in single core design including the performance and the power density, the microprocessor industry has switched their attentions to multicore design to enable the scaling of performance. Thermal effects on multicore systems are still prominent issues. One typical thermal effect is the thermal-aware lifetime reliability, which has become a serious concern. In this paper, we address the issue on how to maximize the lifetime of multicore systems while maintaining a given aggregate processor speed. By applying sequential quadratic programming, we present how to derive the ideal speed for each core to maximize the system lifetime. We perform experiments on several multi-core platforms, which show that the proposed method can significantly outperform the existing approaches by minimizing the peak temperature of the system.
  • Keywords
    logic design; microprocessor chips; multiprocessing systems; power consumption; quadratic programming; semiconductor device reliability; thermal variables measurement; aggregate processor speed; leakage power consumption; microprocessor industry; modern electronic circuits; multicore systems; packaging costs; sequential quadratic programming; single core design; thermal aware lifetime reliability; Costs; Electronic circuits; Electronic packaging thermal management; Energy consumption; Microprocessors; Multicore processing; Power system reliability; System performance; Temperature; Thermal degradation; multicore systems; reliability; thermal-aware issues;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2010 11th International Symposium on
  • Conference_Location
    San Jose, CA
  • ISSN
    1948-3287
  • Print_ISBN
    978-1-4244-6454-8
  • Type

    conf

  • DOI
    10.1109/ISQED.2010.5450548
  • Filename
    5450548