DocumentCode :
2146395
Title :
Thermal-aware lifetime reliability in multicore systems
Author :
Wang, Shengquan ; Chen, Jian-Jia
Author_Institution :
Dept. of Comput. & Inf. Sci., Univ. of Michigan-Dearborn, Dearborn, MI, USA
fYear :
2010
fDate :
22-24 March 2010
Firstpage :
399
Lastpage :
405
Abstract :
As the power density of modern electronic circuits increases dramatically, systems are prone to overheating. High temperatures not only raise packaging costs, degrade system performance, and increase leakage power consumption, but also reduce the system reliability. Due to many limits in single core design including the performance and the power density, the microprocessor industry has switched their attentions to multicore design to enable the scaling of performance. Thermal effects on multicore systems are still prominent issues. One typical thermal effect is the thermal-aware lifetime reliability, which has become a serious concern. In this paper, we address the issue on how to maximize the lifetime of multicore systems while maintaining a given aggregate processor speed. By applying sequential quadratic programming, we present how to derive the ideal speed for each core to maximize the system lifetime. We perform experiments on several multi-core platforms, which show that the proposed method can significantly outperform the existing approaches by minimizing the peak temperature of the system.
Keywords :
logic design; microprocessor chips; multiprocessing systems; power consumption; quadratic programming; semiconductor device reliability; thermal variables measurement; aggregate processor speed; leakage power consumption; microprocessor industry; modern electronic circuits; multicore systems; packaging costs; sequential quadratic programming; single core design; thermal aware lifetime reliability; Costs; Electronic circuits; Electronic packaging thermal management; Energy consumption; Microprocessors; Multicore processing; Power system reliability; System performance; Temperature; Thermal degradation; multicore systems; reliability; thermal-aware issues;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design (ISQED), 2010 11th International Symposium on
Conference_Location :
San Jose, CA
ISSN :
1948-3287
Print_ISBN :
978-1-4244-6454-8
Type :
conf
DOI :
10.1109/ISQED.2010.5450548
Filename :
5450548
Link To Document :
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