• DocumentCode
    2146567
  • Title

    Size reduction of electromagnetic bandgap (EBG) structures with new geometries and materials

  • Author

    Toyota, Yoshitaka ; Engin, A. Ege ; Kim, Tae Hong ; Swaminathan, Madhavan ; Bhattacharya, Swapan

  • Author_Institution
    Dept. of Commun. Network Eng., Okayama Univ.
  • fYear
    0
  • fDate
    0-0 0
  • Abstract
    Size reduction of an electromagnetic bandgap (EBG) structure with large patches and small branches that connect adjacent patches for a power/ground plane pair is studied. To shrink the dimensions with a high isolation at the frequency of interest, this paper provides two approaches. One is a geometric approach which is to place two narrow slits on each patch. The increase of branch inductance with the long slit successfully decreases the on-set frequency of the stopband without increasing the patch size. The other approach is to use high-K material for a thin dielectric layer. In this case, the size reduction can be predicted according to a scaling law. These approaches are applied together to realize an EBG structure with the entire size of less than 20 mm on a side. It covers the GSM band with sufficient isolation. Through this study, the dispersion-diagram analysis is used to predict the stopband characteristics
  • Keywords
    dielectric thin films; high-temperature electronics; photonic band gap; scaling circuits; EBG structure; GSM band; branch inductance; dispersion-diagram analysis; electromagnetic bandgap structures; geometric approach; high-K material; power/ground plane pair; scaling law; size reduction; stopband characteristics; thin dielectric layer; Filters; Frequency; Geometry; High K dielectric materials; High-K gate dielectrics; Lattices; Metamaterials; Passband; Periodic structures; Power engineering and energy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2006. Proceedings. 56th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0152-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2006.1645901
  • Filename
    1645901