DocumentCode :
2146611
Title :
Microstrip to waveguide transition dedicated to wireless millimeter-wave applications
Author :
Hammou, D. ; Nedil, M. ; Kandil, N. ; Coulibaly, Y. ; Moldovan, E. ; Tatu, S.O.
Author_Institution :
Underground Commun. Res. Lab., Univ. de Quebec en Abitibi-Temiscamingue, Val-d´´Or, QC, Canada
fYear :
2012
fDate :
8-14 July 2012
Firstpage :
1
Lastpage :
2
Abstract :
This paper propose a novel millimeter-wave microstrip (MSL) to WR 12 standard rectangular waveguide transition. These dissimilar structures are interconnected via a trapezoidal substrate integrated waveguide (TSIW). The MSL and the TSIW are integrated on the same ceramic substrate of 9.9 of permittivity and 125 of thickness. The MSL has been first transformed into an air-filled rectangular waveguide, and then a horn transformer has been used to match the WR12 waveguide. The central frequency of operation is 61 GHz and dedicated to V-band wireless communications applications. The S parameters measurements of the back-to-back connected transitions show an insertion loss less than 1.5 dB and a return loss better than -10 dB over a 5 GHz bandwidth from 60 to 65 GHz. The high performance and the compact size, enable the transition to be employed in a number of millimeter-wave applications.
Keywords :
microstrip antennas; millimetre wave antennas; permittivity; substrate integrated waveguides; S parameters measurements; V-band wireless communications application; air filled rectangular waveguide; central frequency; ceramic substrate; dissimilar structures; horn transformer; insertion loss; millimeter wave microstrip; permittivity; standard rectangular waveguide transition; trapezoidal substrate integrated waveguide; wireless millimeter wave application; Microstrip; Millimeter wave communication; Millimeter wave measurements; Rectangular waveguides; Waveguide transitions; Millimeter wave circuits; microstrip line; rectangular waveguide; transitions;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium (APSURSI), 2012 IEEE
Conference_Location :
Chicago, IL
ISSN :
1522-3965
Print_ISBN :
978-1-4673-0461-0
Type :
conf
DOI :
10.1109/APS.2012.6348786
Filename :
6348786
Link To Document :
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