Title :
Flex-circuit chip-to-chip interconnects
Author :
Braunisch, Henning ; Jaussi, James E. ; Mix, Jason A. ; Trobough, Mark B. ; Horine, Bryce D. ; Prokofiev, Victor ; Lu, Daoqiang ; Baskaran, Rajashree ; Meier, Pascal C H ; Han, Dong-Ho ; Mallory, Kent E. ; Leddige, Michael W.
Author_Institution :
Intel Corp., Chandler, AZ
Abstract :
High-speed chip-to-chip interconnect utilizing flex-circuit technology is investigated for extending the lifetime of copper-based system-level channels. Proper construction of the flex ribbon is shown to improve the raw bandwidth over FR-4 boards by about three times. Active testing results from a 130-nm CMOS test vehicle show the potential of two times higher data rates. The next generation test vehicle with 90-nm CMOS, described briefly, gives improved voltage and timing margins at 20 Gb/s. High-speed connector solutions, especially results from a "split socket" assembly test vehicle, are discussed in detail
Keywords :
CMOS integrated circuits; copper; electric connectors; flexible electronics; high-speed integrated circuits; integrated circuit interconnections; integrated circuit testing; 130 nm; 20 Gbit/s; 90 nm; CMOS integrated circuit; CMOS test vehicle; FR-4 boards; active testing; copper-based system-level channels; flex ribbon construction; flex-circuit technology; high-speed chip-to-chip interconnect; high-speed connector; split socket assembly; Bandwidth; CMOS technology; Connectors; Insertion loss; Integrated circuit interconnections; LAN interconnection; Packaging; Sockets; Testing; Vehicles;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645912
