Title :
Pitfalls an engineer needs to be aware of during vibration testing
Author :
Malatkar, Pramod ; Wong, Shaw Fong ; Pringle, Troy ; Loh, Wei Keat
Author_Institution :
Intel Corp., Chandler, AZ
Abstract :
In the electronic industry, there is currently a renewed interest in the study of the failure of BGA package and socket solder joints under mechanical stressing, specifically shock and vibration. This means that an analyst now needs to know the proper modeling and test procedures to use in order to better tackle the problem of solder joint reliability under shock and vibration loading. In this paper, an effort has been made to collate the best known methods associated with vibration testing of electronic components mounted on printed circuit boards
Keywords :
ball grid arrays; dynamic testing; failure analysis; internal stresses; printed circuits; solders; BGA package failure; electronic components; electronic industry; mechanical stress; printed circuit boards design; shock loading; socket solder joints; vibration testing; Circuit testing; Electric shock; Electronic components; Electronic equipment testing; Electronics industry; Electronics packaging; Printed circuits; Sockets; Soldering; Vibrations;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645918
