DocumentCode
2146992
Title
Pitfalls an engineer needs to be aware of during vibration testing
Author
Malatkar, Pramod ; Wong, Shaw Fong ; Pringle, Troy ; Loh, Wei Keat
Author_Institution
Intel Corp., Chandler, AZ
fYear
0
fDate
0-0 0
Abstract
In the electronic industry, there is currently a renewed interest in the study of the failure of BGA package and socket solder joints under mechanical stressing, specifically shock and vibration. This means that an analyst now needs to know the proper modeling and test procedures to use in order to better tackle the problem of solder joint reliability under shock and vibration loading. In this paper, an effort has been made to collate the best known methods associated with vibration testing of electronic components mounted on printed circuit boards
Keywords
ball grid arrays; dynamic testing; failure analysis; internal stresses; printed circuits; solders; BGA package failure; electronic components; electronic industry; mechanical stress; printed circuit boards design; shock loading; socket solder joints; vibration testing; Circuit testing; Electric shock; Electronic components; Electronic equipment testing; Electronics industry; Electronics packaging; Printed circuits; Sockets; Soldering; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
1-4244-0152-6
Type
conf
DOI
10.1109/ECTC.2006.1645918
Filename
1645918
Link To Document