• DocumentCode
    2147114
  • Title

    Resistive switching behaviors and mechanism of transition metal oxides-based memory devices

  • Author

    Kang, J.F. ; Sun, B. ; Gao, B. ; Xu, N. ; Sun, X. ; Liu, L.F. ; Wang, Y. ; Liu, X.Y. ; Han, R.Q. ; Wang, Y.Y.

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    921
  • Lastpage
    924
  • Abstract
    In this paper, the characteristics and mechanism of the transition metal oxide (TMO) based resistive switching memory (RRAM) devices were addressed. The results show that doping in oxide matrix materials, electrode material, and operating mode of the set/reset process may significantly affect the resistive switching behaviors of RRAM devices. Optimizing the dopants and matrix materials, electrode materials, device structure, and operating modes and understanding the related mechanisms are required to achieve the excellent device performance of TMO-based RRAM for the memory application. A unified physical model, based on the electron hopping transport between oxygen vacancies along the conductive filament paths, is used to explain and describe the resistive switching behaviors of the TMO based RRAM devices.
  • Keywords
    MIM structures; cerium compounds; doping; electrodes; hopping conduction; optimisation; random-access storage; titanium compounds; vacancies (crystal); zinc compounds; zirconium compounds; CeOx; MIM structure; RRAM devices; TiOx; ZnO; ZrOx; device structure; doping; electrode material; electron hopping transport; operating modes; optimization; oxide matrix materials; oxygen vacancies; resistive switching memory; transition metal oxide; Conducting materials; Doping; Electrodes; Laboratories; Microelectronics; Sun; Temperature; Tin; Voltage; Zinc oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734696
  • Filename
    4734696