Title :
Thermal characterization of a 3-dimensional memory module
Author :
Tae-Hyun Kim ; Baek, Joong-Hyun ; Seol, S.H. ; Kim, J.J. ; Kim, Y.S. ; Sun, Y.B. ; Oh, S.Y.
Author_Institution :
Samsung Electron. Co. Ltd., Kyunggi, South Korea
Abstract :
SAMSUNG Electronics Co. has developed a 3-D memory module technique using a conventional assembly process for plastic package to get improved electrical performance, greater packaging density, and lower system weight and volume. This paper describes the thermal measurement and modeling result performed to determine the maximum junction temperature variation with the number of stacked packages and temperature distributions within 3-D modules. The effect of packaging materials on 3-D module´s thermal performance is also presented
Keywords :
modules; plastic packaging; semiconductor storage; temperature distribution; electrical performance; junction temperature; plastic package; stacked package; temperature distribution; thermal measurement; thermal modeling; three-dimensional memory module; Assembly; Bonding; Diodes; Electronic packaging thermal management; Plastic packaging; Semiconductor device measurement; Temperature distribution; Temperature measurement; Testing; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3139-7
DOI :
10.1109/STHERM.1996.545086
