Thermal characterization of a 3-dimensional memory module

Author

Tae-Hyun Kim ; Baek, Joong-Hyun ; Seol, S.H. ; Kim, J.J. ; Kim, Y.S. ; Sun, Y.B. ; Oh, S.Y.

Author_Institution

Samsung Electron. Co. Ltd., Kyunggi, South Korea

fYear

1996

fDate

5-7 Mar 1996

Firstpage

14

Lastpage

18

Abstract

SAMSUNG Electronics Co. has developed a 3-D memory module technique using a conventional assembly process for plastic package to get improved electrical performance, greater packaging density, and lower system weight and volume. This paper describes the thermal measurement and modeling result performed to determine the maximum junction temperature variation with the number of stacked packages and temperature distributions within 3-D modules. The effect of packaging materials on 3-D module´s thermal performance is also presented

Keywords

modules; plastic packaging; semiconductor storage; temperature distribution; electrical performance; junction temperature; plastic package; stacked package; temperature distribution; thermal measurement; thermal modeling; three-dimensional memory module; Assembly; Bonding; Diodes; Electronic packaging thermal management; Plastic packaging; Semiconductor device measurement; Temperature distribution; Temperature measurement; Testing; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE

Conference_Location

Austin, TX

ISSN

1065-2221

Print_ISBN

0-7803-3139-7

Type

conf

DOI

10.1109/STHERM.1996.545086

Filename

545086