3D thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits

Author

Dorkel, J.-M. ; Tounsi, P. ; Leturcq, Ph

Author_Institution

Lab. d´´Anal. et d´´Archit. des Syst., CNRS, Toulouse, France

fYear

1996

fDate

5-7 Mar 1996

Firstpage

81

Lastpage

88

Abstract

This paper recalls how the two-port network theory can be extended to 3D conductive heat transfer in multi-layered plane structures. It is shown how efficient computation tools can be built up by implementing this theory with the help of FFT algorithms. These tools are particularly well-suited for the rapid thermal analysis of power components or hybrid and integrated power circuits. An illustration of the thermal analysis of an IGBT power module is also given

Keywords

fast Fourier transforms; heat conduction; hybrid integrated circuits; insulated gate bipolar transistors; power integrated circuits; thermal analysis; two-port networks; 3D conductive heat transfer; 3D thermal modeling; FFT algorithms; IGBT power module; computation tools; hybrid power ICs; monolithic power ICs; multi-layered plane structures; power circuits; power components; rapid thermal analysis; two-port network theory; Circuits; Electronic packaging thermal management; Equations; Insulated gate bipolar transistors; Multichip modules; Power electronics; Rapid thermal processing; Temperature distribution; Thermal conductivity; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE

Conference_Location

Austin, TX

ISSN

1065-2221

Print_ISBN

0-7803-3139-7

Type

conf

DOI

10.1109/STHERM.1996.545096

Filename

545096