Title :
Thermal modeling of densely packed electronic systems
Author_Institution :
Philips Technol., Cambridge, MD, USA
Abstract :
Thermal modeling of densely packed electromechanical systems is investigated by conducting three dimensional, steady-state computations of flow and heat transfer. Coupled conduction and natural convection in a densely packed system is considered. For a fixed energy generation rate, computations are performed for different thermophysical properties of the system walls, and component configurations in sealed and vented systems. Overall lower temperatures are observed in vented systems with high thermal conductivity system walls and large component configurations. An empirical correlation is developed for the maximum component temperature over the range of parameters studied
Keywords :
cooling; forced convection; heat conduction; packaging; seals (stoppers); thermal analysis; thermal conductivity; ventilation; component configurations; coupled conduction; densely packed electronic systems; fixed energy generation rate; heat transfer; maximum component temperature; natural convection; sealed systems; steady-state computations; thermal conductivity; thermal modeling; thermophysical properties; vented systems; Consumer electronics; Costs; Electronic equipment; Electronics cooling; Heat transfer; Mechanical systems; Steady-state; Telephony; Temperature distribution; Thermal conductivity;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3139-7
DOI :
10.1109/STHERM.1996.545098
