DocumentCode :
2147730
Title :
Ultrahigh-voltage SiC devices for future power infrastructure
Author :
Kimoto, Tatsuya
Author_Institution :
Dept. of Electron. Sci. & Eng., Kyoto Univ., Kyoto, Japan
fYear :
2013
fDate :
16-20 Sept. 2013
Firstpage :
22
Lastpage :
29
Abstract :
Silicon carbide (SiC) is a newly-emerging wide bandgap semiconductor, by which high-voltage, low-loss power devices can be realized owing to its superior properties. This paper reviews recent progress in SiC material and device technologies for power device applications. Benefits and remaining issues of ultrahigh-voltage SiC power devices are highlighted. Through progress in fast epitaxy and defect reduction technologies, high-purity (~1014 cm-3) and thick (> 100 μm) SiC epilayers with long carrier lifetimes (> 30 μs) can be employed for fabrication of ultrahigh-voltage devices. By utilizing such epilayers and appropriate junction termination structures, ultrahigh-voltage blocking over 20 kV has been achieved in SiC PiN diodes and transistors.
Keywords :
carrier lifetime; power semiconductor devices; silicon compounds; wide band gap semiconductors; PiN diodes; SiC; carrier lifetimes; defect reduction technologies; epilayers; fast epitaxy; future power infrastructure; high-voltage low-loss power devices; junction termination structures; power device applications; silicon carbide; ultrahigh-voltage blocking; ultrahigh-voltage devices; wide bandgap semiconductor; Insulated gate bipolar transistors; MOSFET; Oxidation; PIN photodiodes; Silicon; Silicon carbide; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European
Conference_Location :
Bucharest
Type :
conf
DOI :
10.1109/ESSDERC.2013.6818812
Filename :
6818812
Link To Document :
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