DocumentCode
2148058
Title
Temperature dependence of breakdown in anisotropic 6H-SiC MOSFET
Author
Li, Liu ; Yin-tang, Yang ; Chang-chun, Chai
Author_Institution
Minist. of Edu. Key Lab. Of Wide Band-Gap Semicond. Mater. & Devices, Xidian Univ., Xi´´an, China
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
1126
Lastpage
1129
Abstract
The influence of temperature on the breakdown in anisotropic 6H-SiC MOSFET is studied. Taken Si face as an example , the influence of temperature on the breakdown voltage, critical electrical field and specific on-state resistance is thoroughly analyzed. Considering the anisotropy of material, anisotropy of the breakdown is obtained in different face but the tendency of breakdown voltage vs. temperature is same, both has positive temperature coefficient.
Keywords
MOSFET; electric breakdown; electric fields; silicon compounds; wide band gap semiconductors; SiC; anisotropic MOSFET; breakdown voltage; critical electrical field; positive temperature coefficient; silicon face; specific on-state resistance; temperature dependence; Anisotropic magnetoresistance; Charge carrier processes; Electric breakdown; Electrons; Impact ionization; MOSFET circuits; Semiconductor device modeling; Semiconductor materials; Silicon carbide; Temperature dependence;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4734735
Filename
4734735
Link To Document