DocumentCode :
2148374
Title :
Single wafer all-wet photo resist strip process for LDD implant in CMOS technology
Author :
Bonfanti, Paolo ; Sellmer, Reinhard ; Liu, Glen ; He, Youfeng ; Hao, Liu ; Henry, Sally-Ann ; Deutschmann, Lutz ; Archer, Leo
Author_Institution :
SMIC, Beijing, China
fYear :
2008
fDate :
20-23 Oct. 2008
Firstpage :
1177
Lastpage :
1179
Abstract :
This paper reports the comparison between conventional ash followed by wet bench process approach and the new all wet process for LDD implant application. The comparison covers the areas of defect performance, (material loss, electrical data, yield) and chemical consumption.
Keywords :
CMOS integrated circuits; photoresists; CMOS technology; LDD implant; single wafer all-wet photo resist strip process; CMOS process; CMOS technology; Chemicals; Cleaning; Implants; Performance loss; Resists; Strips; Substrates; Thickness control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
Type :
conf
DOI :
10.1109/ICSICT.2008.4734748
Filename :
4734748
Link To Document :
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