DocumentCode
2148416
Title
A study of inverse narrow width effect of 65nm low power CMOS technology
Author
Xinfu, Liu ; Kheeyong, Lim ; Zhihua, Wu ; Zhibin, Xiong ; Yongping, Ding ; Hao, Nong ; Yanping, Wu ; Yanping, Shen ; Bin, Tang ; Louis, Lim ; Sally, Chwa ; Xing, Yu ; Feng, Hong ; Yang, Simon
Author_Institution
Chartered Semicond. Manuf. Ltd., Singapore, Singapore
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
1138
Lastpage
1141
Abstract
In this paper, we present the investigation of inverse narrow width effect (INWE) of 65 nm low-power process with dual gate oxide shapes. To evaluate the impact of STI process on narrow devices, we conducted different experiments in STI process steps, including STI liner, STI elevation, STI liner annealing and STI nitride pullback. The result shows only STI liner annealing and STI nitride pullback have impact on the INWE of MOSFETs. Different gate oxidation methods are also experimented. It is found that gate oxidation process gives a strong impact on the mobility of narrow width devices and makes narrow width transistors behavior significantly different.
Keywords
CMOS integrated circuits; oxidation; dual gate oxide shapes; inverse narrow width effect; liner annealing; low power CMOS technology; nitride pullback; size 65 nm; transistors behavior; Annealing; CMOS process; CMOS technology; Geometry; MOSFETs; Manufacturing processes; Oxidation; Pulp manufacturing; Shape; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4734750
Filename
4734750
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