• DocumentCode
    2148416
  • Title

    A study of inverse narrow width effect of 65nm low power CMOS technology

  • Author

    Xinfu, Liu ; Kheeyong, Lim ; Zhihua, Wu ; Zhibin, Xiong ; Yongping, Ding ; Hao, Nong ; Yanping, Wu ; Yanping, Shen ; Bin, Tang ; Louis, Lim ; Sally, Chwa ; Xing, Yu ; Feng, Hong ; Yang, Simon

  • Author_Institution
    Chartered Semicond. Manuf. Ltd., Singapore, Singapore
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    1138
  • Lastpage
    1141
  • Abstract
    In this paper, we present the investigation of inverse narrow width effect (INWE) of 65 nm low-power process with dual gate oxide shapes. To evaluate the impact of STI process on narrow devices, we conducted different experiments in STI process steps, including STI liner, STI elevation, STI liner annealing and STI nitride pullback. The result shows only STI liner annealing and STI nitride pullback have impact on the INWE of MOSFETs. Different gate oxidation methods are also experimented. It is found that gate oxidation process gives a strong impact on the mobility of narrow width devices and makes narrow width transistors behavior significantly different.
  • Keywords
    CMOS integrated circuits; oxidation; dual gate oxide shapes; inverse narrow width effect; liner annealing; low power CMOS technology; nitride pullback; size 65 nm; transistors behavior; Annealing; CMOS process; CMOS technology; Geometry; MOSFETs; Manufacturing processes; Oxidation; Pulp manufacturing; Shape; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734750
  • Filename
    4734750