• DocumentCode
    2148584
  • Title

    Multi-Layered Substrates for Wireless Communication Modules at 60GHz

  • Author

    Amano, Y. ; Suematsu, E. ; Zhu, Y. ; Yamada, A. ; Kakimoto, N. ; Sato, H. ; Hashizume, N.

  • Author_Institution
    Advanced Technology Research Laboratories, SHARP Corporation, 2613-1 Ichinomoto-cho, Tenri, Nara 632-8567, Japan. Tel: 81-7436-5-2485, Fax: 81-7436-5-2487, E-mail: amano@mic.tnr.sharp.co.jp
  • Volume
    2
  • fYear
    1999
  • fDate
    Oct. 1999
  • Firstpage
    301
  • Lastpage
    304
  • Abstract
    A low-cost module structure for millimeterwave wireless communication is proposed. Hermetically sealed circuits and printed antennas are built on the opposite sides of a multi-layered substrate. Slot-coupled electromagnetic interconnects in multi-layered substrates with more than three layers were investigated experimentally. Broad band 50¿ matching and about 4.6dBi gain were achieved by a single patch antenna directly printed on the ceramic multilayered substrate with high ¿r = 8.9. Suitability of the proposed structure for array antenna design is discussed.
  • Keywords
    Ceramics; Circuit simulation; Frequency; Hermetic seals; Integrated circuit interconnections; Microwave antenna arrays; Patch antennas; Propagation losses; Slot antennas; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 1999. 29th European
  • Conference_Location
    Munich, Germany
  • Type

    conf

  • DOI
    10.1109/EUMA.1999.338360
  • Filename
    4139500
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2148584