Title :
Multi-Layered Substrates for Wireless Communication Modules at 60GHz
Author :
Amano, Y. ; Suematsu, E. ; Zhu, Y. ; Yamada, A. ; Kakimoto, N. ; Sato, H. ; Hashizume, N.
Author_Institution :
Advanced Technology Research Laboratories, SHARP Corporation, 2613-1 Ichinomoto-cho, Tenri, Nara 632-8567, Japan. Tel: 81-7436-5-2485, Fax: 81-7436-5-2487, E-mail: amano@mic.tnr.sharp.co.jp
Abstract :
A low-cost module structure for millimeterwave wireless communication is proposed. Hermetically sealed circuits and printed antennas are built on the opposite sides of a multi-layered substrate. Slot-coupled electromagnetic interconnects in multi-layered substrates with more than three layers were investigated experimentally. Broad band 50¿ matching and about 4.6dBi gain were achieved by a single patch antenna directly printed on the ceramic multilayered substrate with high ¿r = 8.9. Suitability of the proposed structure for array antenna design is discussed.
Keywords :
Ceramics; Circuit simulation; Frequency; Hermetic seals; Integrated circuit interconnections; Microwave antenna arrays; Patch antennas; Propagation losses; Slot antennas; Wireless communication;
Conference_Titel :
Microwave Conference, 1999. 29th European
Conference_Location :
Munich, Germany
DOI :
10.1109/EUMA.1999.338360
