Title :
The study on the thermal behavior of packaged power LEDs
Author :
Zhang, Guangchen ; Feng, Shiwei ; Wang, Lu ; Xie, Xuesong ; Gao, Lichao ; Meng, Haijie
Author_Institution :
Sch. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China
Abstract :
The reliability of power LEDs has strong dependence on successful package thermal management. In this paper, heating response curves of LEDs were recorded by the temperature sensitive parameter (TSP) method and fast-switching circuit techniques. It provided a novel method to analyze thermal resistance composition of power LED¿s packaging. Cover-and-block method was presented to provide a correction to the apparent thermal resistance of optical devices, and an electrical method to obtain radiant efficiency was also put forward.
Keywords :
light emitting diodes; reliability; thermal management (packaging); thermal resistance; cover-and-block method; fast-switching circuit techniques; heating response curves; packaged power LED; temperature sensitive parameter method; thermal management; thermal resistance composition; Circuits; Electric resistance; Energy management; Heating; Light emitting diodes; Optical devices; Packaging; Temperature sensors; Thermal management; Thermal resistance; packaged power LED; radiant efficiency; reliability; thermal resistance;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
DOI :
10.1109/ICSICT.2008.4734765
