• DocumentCode
    2148955
  • Title

    Simulated profiles from the layout-design interface in X (SIMPL-DIX)

  • Author

    Wu, H.C. ; Wong, A.S. ; Koh, Y.L. ; Scheckler, E.W. ; Neureuther, A.R.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
  • fYear
    1988
  • fDate
    11-14 Dec. 1988
  • Firstpage
    328
  • Lastpage
    331
  • Abstract
    SIMPL-DIX is an X-window-based interactive computer-aided-design tool for running process and device simulators from layout and process specifications. Using an interactive menu, scanning-electron-microscope-like cross-sections along a cut line on the layout can be generated and investigated. with internal analysis tools, the system provides design interfaces for highlighting locations where topography problems are anticipated (HUNCH), for identifying the effects of misalignment (WORST), and for critiquing the resulting topography profiles (CRITIC). As a process simulation manager, SIMPL-DIX allows processes to be simulated either rapidly with elementary models in SIMPL-2 or rigorously through calls to external process simulators such as SAMPLE and CREEP. SIMPL-DIX is also a convenient interface for generating input files for PISCES II and SUPREM III.<>
  • Keywords
    CAD; electronic engineering computing; integrated circuit technology; semiconductor device models; CREEP; CRITIC; HUNCH; PISCES II; SAMPLE; SIMPL-DIX; SUPREM III; WORST; X-window-based interactive computer-aided-design tool; device simulators; external process simulators; interactive menu; internal analysis tools; layout-design interface; misalignment; process simulation manager; scanning-electron-microscope-like cross-sections; topography problems; topography profiles; Circuit simulation; Computational modeling; Computer simulation; Creep; Displays; Graphics; Laboratories; Layout; Mice; Surfaces;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.1988.32823
  • Filename
    32823