Functional Multilayer Ceramic Substrate for Rfmodules

The trend to smaller thinner and lighter portable electronics is accelerating to the market. These demands are required in RF modules. We have developed a Functional multilayer ceramic substrate (F-MLCS) with a flexible ceramic dsign technology to realize size reduction ofRF modules with low power consumption, high efficiency, and low cost. The F-MLCS incorporates built-in coupler and inductor, capacitor to compose impedance matching circuits. Flexibility in the design of the inductor, capecitor, and coupler is essential to realize miniaturization of RF modules. Adopting of F-MLCS for RF modules, with built-in inductor, capacitor, and coupler, has shown to significantly reduce size to 5.0mm × 7.0mm × 0.7mm. The impedance matching circuit and coupler have met the simulation results to clearly show achievement of high performance.