DocumentCode
2149086
Title
Reliability tests for discriminating between technological variants of QFN packaging
Author
Bazu, M. ; Ilian, V.E. ; Varsescu, D. ; Galateanu, Lucian ; Sikio, Vili ; Reimets, Meelis ; Uhl, Volker ; Weiss, Michael
Author_Institution
Nat. Inst. for R&D in Microtechnologies, IMT-Bucharest, Bucharest, Romania
fYear
2013
fDate
16-20 Sept. 2013
Firstpage
226
Lastpage
229
Abstract
A procedure of reliability testing for discriminating between various technological variants is described. This procedure is used for choosing the most reliable variant of QFN packaging, the competitors being the conventional oven curing against three variants of microwave curing. The results, based on failure analysis and statistical processing of data, clearly show that the best choice is one of the variants of microwave curing.
Keywords
curing; electron device testing; electronics packaging; failure analysis; QFN packaging; competitors; conventional oven curing; failure analysis; microwave curing; reliability testing; statistical data processing; Curing; Failure analysis; Humidity; Microwave integrated circuits; Microwave ovens; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European
Conference_Location
Bucharest
Type
conf
DOI
10.1109/ESSDERC.2013.6818860
Filename
6818860
Link To Document