DocumentCode :
2149129
Title :
Impact of statistical variability and charge trapping on 14 nm SOI FinFET SRAM cell stability
Author :
Xingsheng Wang ; Binjie Cheng ; Brown, A.R. ; Millar, C. ; Kuang, Jente B. ; Nassif, S. ; Asenov, Asen
Author_Institution :
Device Modelling Group, Univ. of Glasgow, Glasgow, UK
fYear :
2013
fDate :
16-20 Sept. 2013
Firstpage :
234
Lastpage :
237
Abstract :
Variability is a critical concern for the stability and yield of SRAM with minimized size. We present a study of a 14 nm node SOI FinFET SRAM cell under the influence of statistical variability and random charge trapping due to positive/negative bias temperature instability (P/NBTI). Low channel doping is believed to be one of the main advantages of FinFETs in reducing statistical variability, but fin and gate edge roughness and metal gate granularity can cause significant variability and affect SRAM stability. The noise margins are largely skewed, and read and write noise margins are decorrelated due to statistical variability. Under heavy stress conditions cell read noise margin can be degraded by 30mV on average due to charge trapping, and its 6σ-yield becomes even worse due to the enhanced variability in N/PBTI.
Keywords :
MOSFET circuits; SRAM chips; integrated circuit modelling; negative bias temperature instability; semiconductor doping; silicon-on-insulator; statistical analysis; FinFET SRAM cell stability; P/NBTI; SOI; channel doping; charge trapping; fin edge roughness; gate edge roughness; metal gate granularity; noise margins; positive/negative bias temperature instability; silicon-on-insulator; size 14 nm; statistical variability; Charge carrier processes; FinFETs; Logic gates; Noise; SRAM cells; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European
Conference_Location :
Bucharest
Type :
conf
DOI :
10.1109/ESSDERC.2013.6818862
Filename :
6818862
Link To Document :
بازگشت