Title :
NUMANA: A hybrid numerical and analytical thermal simulator for 3-D ICs
Author :
Lee, Yu-Min ; Wu, Tsung-Heng ; Huang, Pei-Yu ; Yang, Chi-Ping
Author_Institution :
National Chiao Tung University, Taiwan
Abstract :
By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.
Keywords :
Conductivity; Integrated circuit modeling; Temperature distribution; Thermal analysis; Thermal conductivity; Vectors;
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013
Conference_Location :
Grenoble, France
Print_ISBN :
978-1-4673-5071-6
DOI :
10.7873/DATE.2013.282
