Explicit transient thermal simulation of liquid-cooled 3D ICs

The high heat flux and compact structure of three-dimensional circuits (3D ICs) make conventional air-cooled devices more subsceptible to overheating. Liquid cooling is an alternative that can improve heat dissipation, and reduce thermal issues. Fast and accurate thermal models are needed to appropriately dimension the cooling system at design time. Several models have been proposed to study different designs, but generally with low simulation performance. In this paper, we present an efficient model of the transient thermal behaviour of liquid-cooled 3D ICs. In our experiments, our approach is 60 times faster and uses 600 times less memory than state-of-the-art models, while maintaining the same level of accuracy.