DocumentCode :
2149442
Title :
Design and array implementation a cantilever-based non-volatile memory utilizing vibrational reset
Author :
Anh Tuan Do ; Gopal, Jayaraman Karthik ; Singh, Prashant ; Chua Geng Li ; Kiat Seng Yeo ; Kim, Tony Tae-Hyoung
Author_Institution :
IC Design Centre of Excellence, Nanyang Technol. Univ., Singapore, Singapore
fYear :
2013
fDate :
16-20 Sept. 2013
Firstpage :
284
Lastpage :
287
Abstract :
This paper proposes a cantilever-based memory structure for storing binary data at extreme operating temperature (up to 300°C) in rugged electronics. The memory bit (0/1) is formed by opening/closing of an electrostatic switch. Permanent retention is obtained by adhesive force between two smooth surfaces in contact, eliminating leakage observed in all types of storage-layer-based NVMs. The Reset utilizes a train of short pulses to break the adhesion between the electrodes. This allows the Nano-electromechanical switch (NEMS) memory to be implemented using a simple bi-layer design and easily integrated with CMOS platforms. We propose an array structure where each memory cell consists of a NEMS memory device and one NMOS transistor for full random-access operation.
Keywords :
CMOS memory circuits; MOSFET; adhesion; cantilevers; electrical contacts; microswitches; nanoelectromechanical devices; random-access storage; CMOS platforms; NEMS memory device; NMOS transistor; adhesion; adhesive force; array implementation; bi-layer design; binary data; cantilever-based memory structure; cantilever-based nonvolatile memory; contact; electrodes; electrostatic switch; memory bit; memory cell; nanoelectromechanical switch; permanent retention; random-access operation; rugged electronics; short pulses; smooth surfaces; storage layer; vibrational reset; Actuators; Arrays; Delays; Force; Nanoelectromechanical systems; Nonvolatile memory; Temperature measurement; NEM NVM; cantilever-based; vibrational reset;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European
Conference_Location :
Bucharest
Type :
conf
DOI :
10.1109/ESSDERC.2013.6818874
Filename :
6818874
Link To Document :
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