• DocumentCode
    2149442
  • Title

    Design and array implementation a cantilever-based non-volatile memory utilizing vibrational reset

  • Author

    Anh Tuan Do ; Gopal, Jayaraman Karthik ; Singh, Prashant ; Chua Geng Li ; Kiat Seng Yeo ; Kim, Tony Tae-Hyoung

  • Author_Institution
    IC Design Centre of Excellence, Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2013
  • fDate
    16-20 Sept. 2013
  • Firstpage
    284
  • Lastpage
    287
  • Abstract
    This paper proposes a cantilever-based memory structure for storing binary data at extreme operating temperature (up to 300°C) in rugged electronics. The memory bit (0/1) is formed by opening/closing of an electrostatic switch. Permanent retention is obtained by adhesive force between two smooth surfaces in contact, eliminating leakage observed in all types of storage-layer-based NVMs. The Reset utilizes a train of short pulses to break the adhesion between the electrodes. This allows the Nano-electromechanical switch (NEMS) memory to be implemented using a simple bi-layer design and easily integrated with CMOS platforms. We propose an array structure where each memory cell consists of a NEMS memory device and one NMOS transistor for full random-access operation.
  • Keywords
    CMOS memory circuits; MOSFET; adhesion; cantilevers; electrical contacts; microswitches; nanoelectromechanical devices; random-access storage; CMOS platforms; NEMS memory device; NMOS transistor; adhesion; adhesive force; array implementation; bi-layer design; binary data; cantilever-based memory structure; cantilever-based nonvolatile memory; contact; electrodes; electrostatic switch; memory bit; memory cell; nanoelectromechanical switch; permanent retention; random-access operation; rugged electronics; short pulses; smooth surfaces; storage layer; vibrational reset; Actuators; Arrays; Delays; Force; Nanoelectromechanical systems; Nonvolatile memory; Temperature measurement; NEM NVM; cantilever-based; vibrational reset;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European
  • Conference_Location
    Bucharest
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2013.6818874
  • Filename
    6818874