Simulation of step coverage profiles and film microstructure

Author

Brett, M.J. ; Westra, K.L. ; Smy, T.

Author_Institution

Dept. of Electr. Eng., Alberta Univ., Edmonton, Alta., Canada

fYear

1988

fDate

11-14 Dec. 1988

Firstpage

336

Lastpage

339

Abstract

Ballistic deposition of hard disks has been used for computer simulation of thin-film growth over a step in a substrate. Up to 16000 particles were deposited per simulation using an angular distribution of particle trajectories representative of planar magnetron sputter deposition and incorporating a surface mobility model for deposited particles. The simulated films show a surface profile evolution during growth and an orientation of columnar film microstructure that approximate the surface profile and microstructure observed in real films of aluminum sputter-deposited over an oxide step on a silicon substrate.<>

Keywords

aluminium; crystal microstructure; digital simulation; metallic thin films; metallisation; sputtered coatings; surface structure; Al-SiO/sub 2/-Si; Si substrate; angular distribution of particle trajectories; ballistic deposition; columnar film; computer simulation; film microstructure; hard disks; planar magnetron sputter deposition; step coverage profiles; surface mobility model; surface profile evolution; thin-film growth; Atherosclerosis; Chemical vapor deposition; Circuit simulation; Computational modeling; Integrated circuit modeling; Microstructure; Semiconductor films; Sputtering; Substrates; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International

Conference_Location

San Francisco, CA, USA

ISSN

0163-1918

Type

conf

DOI

10.1109/IEDM.1988.32825

Filename

32825