Estimation of side-hole location using circular wavefront of scattering waves visualized by pulsed laser scanning

The side-hole (defect) location in a solid material is roughly estimated from the circular wavefront of scattering waves. The measurement data recorded by a pulsed laser scanning system is employed for estimation. The preprocessing involves two steps: The peaks are extracted from the original echo signals, and then, a threshold level of 10% is applied to the peak-extracted data. The side-hole location is reasonably detected using the scattering wavefront obtained immediately after the wave is reflected from the defect.