Title :
60GHz high speed wireless link - technology and design challenges
Author :
Wang, Dawn ; Cahoon, Ned
Author_Institution :
IBM Corp., Westford, MA, USA
Abstract :
The recent success of millimeter wave integrated circuit designs in silicon has triggered a wave of interest and activity in a wide range of high speed wireless applications at 60 GHz. In this paper, we will review the latest developments in design and technology for 60 GHz multi-gigabit-per-second wireless communications. We will address the requirements and challenges for device performance, modeling and circuit design at millimeter wave frequencies, with a discussion of the advantages and disadvantages of SiGe BiCMOS and RFCMOS technology. Packaging, antenna design and integration will also be discussed.
Keywords :
BiCMOS integrated circuits; Ge-Si alloys; bipolar MIMIC; integrated circuit design; packaging; BiCMOS technology; RFCMOS technology; SiGe; antenna design; frequency 60 GHz; high speed wireless link; millimeter wave integrated circuit; multi-gigabit-per-second wireless communications; Circuit synthesis; Frequency; Integrated circuit synthesis; Integrated circuit technology; Millimeter wave circuits; Millimeter wave devices; Millimeter wave integrated circuits; Millimeter wave technology; Silicon; Wireless communication;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
DOI :
10.1109/ICSICT.2008.4734799
