• DocumentCode
    2149688
  • Title

    InP-based HEMTs with AlIn1-xP Schottky barrier layers grown by gas-source MBE

  • Author

    Brown, J.J. ; Matloubian, M. ; Liu, T.K. ; Jelloian, L.M. ; Schmitz, A.E. ; Wilson, R.G. ; Lui, M. ; Larson, L.E. ; Melendes, M.A. ; Thompson, M.A.

  • Author_Institution
    Hughes Res. Labs., Malibu, CA, USA
  • fYear
    1994
  • fDate
    27-31 Mar 1994
  • Firstpage
    419
  • Lastpage
    422
  • Abstract
    We report on the performance of a new class of InP-based HEMTs in which the conventional AlxIn1-xAs Schottky barrier layer is replaced with AlxIn1-xP. The study of alternative Schottky barrier designs is aimed at improving the performance of InP-based HEMTs for applications that require high breakdown voltages, such as microwave power amplifiers. The typical low gate-to-drain breakdown voltage (BVgd) of <-5 V reported for Al0.48In0.52As/GaInPLs HEMTs limits the device performance for high power applications. A significant research effort has concentrated on improving BVgd by increasing the aluminum concentration in the AlInAs layer. An increase in BVgd from -5 V to -10 V has been achieved in our laboratory by increasing the aluminum concentration in the AlxIn1-xAs Schottky layer from x=0.48 to x=0.70. Other researchers have reported BVgd as high as -13 V for an In0.4Al0.6As/n+-InGaAs HFET with a gate length of 1.9 μm. These breakdown voltages are, however, still much lower than typical values of BVgd>20 V reported for GaAs MESFETs and HEMTs. In addition, the increased Al concentration may limit both device reliability and yield due to poor gate metal adhesion to the Al-rich layer. Phosphorous containing materials are an attractive candidate for a wide bandgap Schottky layer design with low aluminum content. A pseudomorphic GaAs-based HEMT with Al0.52In0.48P barrier layer has been reported with BVgd of -17 V and -10 V for 1.0 and 0.1 μm long gate devices, respectively. More recently, a pseudomorphic channel InP HEMT with an Al0.2In0.8P barrier was reported with a BVgd=-15 V for a gate length of 0.5 μm. In this paper, we present for the first time the performance of a AlxIn1-xP/AlInAs/GaInAs HEMT in which the channel is lattice matched to the InP substrate. We compare the performance of this new device with an Al0.6In0.4As/Al0.48In0.52 As/Ga0.47In0.$ d53As HEMT to illustrate the improved device characteristics with the AlInP barrier layer
  • Keywords
    III-V semiconductors; Schottky effect; aluminium compounds; high electron mobility transistors; indium compounds; molecular beam epitaxial growth; power transistors; reliability; semiconductor epitaxial layers; semiconductor growth; solid-state microwave devices; HEMTs; InP-AlInP; Schottky barrier layers; breakdown voltages; device characteristics; device reliability; gas-source MBE; gate length; gate metal adhesion; lattice matched channel; microwave power amplifiers; yield; Aluminum; Gallium arsenide; HEMTs; High power amplifiers; Indium phosphide; Laboratories; MODFETs; Microwave amplifiers; Microwave devices; Schottky barriers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1994. Conference Proceedings., Sixth International Conference on
  • Conference_Location
    Santa Barbara, CA
  • Print_ISBN
    0-7803-1476-X
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1994.328259
  • Filename
    328259