DocumentCode
2149786
Title
Reduction of momentum and spin relaxation rate in strained thin silicon films
Author
Osintsev, Dmitri ; Sverdlov, Viktor ; Selberherr, Siegfried
Author_Institution
Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
fYear
2013
fDate
16-20 Sept. 2013
Firstpage
334
Lastpage
337
Abstract
We investigate the surface roughness and phonon induced spin and momentum relaxation in ultra-scaled SOI MOSFETs. We show that the spin-flip hot spots characterized by strong spin relaxation can be efficiently removed by applying shear strain resulting in an increase of spin lifetime by orders of magnitude. In contrast, the momentum relaxation time in ultrathin films, which is mostly determined by surface roughness scattering can be only increased by a factor of two, in agreement with strain-induced mobility enhancement data.
Keywords
MOSFET; carrier mobility; elemental semiconductors; phonons; semiconductor thin films; shear strength; silicon; silicon-on-insulator; surface roughness; surface scattering; Si; momentum reduction; momentum relaxation; momentum relaxation time; phonon induced spin; shear strain; spin lifetime; spin-flip hot spots; strain-induced mobility enhancement data; strained thin silicon films; strong spin relaxation rate; surface roughness scattering; ultrascaled SOI MOSFET; Films; Phonons; Rough surfaces; Scattering; Silicon; Strain; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European
Conference_Location
Bucharest
Type
conf
DOI
10.1109/ESSDERC.2013.6818886
Filename
6818886
Link To Document