Title :
Novel InP/InGaAs double-heterojunction bipolar transistors suitable for high-speed IC´s and OEIC´s
Author :
Matsuoka, Yutaka ; Nakajima, Hiroki ; Kurishima, Kenji ; Kobayashi, Takashi ; Yoneyama, Mikio ; Sano, Eiichi
Author_Institution :
NTT LSI Labs., Kanagawa, Japan
Abstract :
This paper proposes a novel collector structure for high-performance InP/InGaAs double-heterojunction bipolar transistors (DHBT´s) with layer compatibility for high-speed pin photodiodes (PD´s) and describes their successful performance. The collector has a potential notch formed by thin p+- and n+-InGaAs layers between a relatively thick undoped InGaAs layer and an N-InP layer. The notch effectively suppresses the electron blocking effect, which is generally observed in DHBTs at high collector current. The thin p+-InGaAs layer also raises the conduction band in the collector to enhance the ballistic transport of electrons. Breakdown voltage increases because the major part of the potential change at high collector bias occur in the N-InP layer due to the spreading of the depletion layer. The layer compatibility of both the high-performance DHBT´s and high-speed PD´s enables us to easily manufacture optoelectronic integrated circuits (OEIC´s), because of the simultaneous layer growth and device fabrication of PD´s and DHBT´s without any additional process. We obtained 160-GHz fT and 162-GHz fmax for a DHBT with a 1.6×4.6-μm2 emitter. The fT value reached 124 GHz at low VCE of 0.65 V owing to the suppressed electron blocking effect. A small DHBT with a 0.6×1.6-μm2 emitter operated with 118-GHz f T and 148-GHz -fmax at an Ic as low as 1 mA. A photoreceiver OEIC comprising a pin PD and an HBT preamplifier operates error free up to 6 Gbit/s for 1.55-μm wavelength NRZ signals
Keywords :
III-V semiconductors; bipolar integrated circuits; gallium arsenide; heterojunction bipolar transistors; indium compounds; integrated optoelectronics; optical receivers; 1 mA; 1.55 micron; 118 to 162 GHz; 6 Gbit/s; DHBTs; HBT preamplifier; InP-InGaAs; N-InP layer; OEIC; PIN photodiode; ballistic transport; breakdown voltage; collector structure; conduction band; depletion layer; device fabrication; double-heterojunction bipolar transistors; electron blocking effect; high-speed IC; high-speed p-i-n photodiodes; layer growth; n+-InGaAs layer; optoelectronic integrated circuits; p+-InGaAs layer; photoreceiver OEIC; potential notch; undoped InGaAs layer; Ballistic transport; Bipolar transistors; DH-HEMTs; Double heterojunction bipolar transistors; Electrons; Indium gallium arsenide; Indium phosphide; Integrated circuit manufacture; Manufacturing processes; PIN photodiodes;
Conference_Titel :
Indium Phosphide and Related Materials, 1994. Conference Proceedings., Sixth International Conference on
Conference_Location :
Santa Barbara, CA
Print_ISBN :
0-7803-1476-X
DOI :
10.1109/ICIPRM.1994.328292