Title :
A new manufacturing and packaging technology for the integration of power electronics
Author :
Hofsajer, I.W. ; Ferreira, J.A. ; van Wyk, J.D.
Author_Institution :
Energy Lab., Rand Afrikaans Univ., Aukland Park, South Africa
Abstract :
In this paper, a new manufacturing and packaging technology for power electronics is described and evaluated. This technology is required to fulfil the need for cost effective, mass market, power electronics products. The packaging is based on a new planar technology that is well suited to mass production. One of the features of the packaging is the incorporation of the entire power converter inside the magnetic structures of the converter. This leads to very good magnetic shielding, as well as other benefits, but also gives rise to other problems. The technology is illustrated with the integration of an experimental dual active bridge DC-DC power converter. The design as well as the construction of the converter is described
Keywords :
DC-DC power convertors; bridge circuits; field effect transistor switches; magnetic shielding; power MOSFET; power field effect transistors; power semiconductor switches; semiconductor device manufacture; semiconductor device packaging; switching circuits; construction; design; dual active bridge DC-DC power converter; magnetic shielding; magnetic structures; manufacturing technology; mass production; packaging technology; planar technology; power electronics; Capacitance; Components, packaging, and manufacturing technology; Conductors; Costs; Electronics packaging; Magnetic shielding; Manufacturing processes; Mass production; Power electronics; Pulp manufacturing;
Conference_Titel :
Industry Applications Conference, 1995. Thirtieth IAS Annual Meeting, IAS '95., Conference Record of the 1995 IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3008-0
DOI :
10.1109/IAS.1995.530392
