Title :
Novel designs in power modules
Author :
Van Godbold, C. ; Sankaran, V. Anand ; Hudgins, Jerry L.
Author_Institution :
Dept. of Electr. Eng., South Carolina Univ., Columbia, SC, USA
Abstract :
This work is a brief comparison of the three different packaging technologies used in present-day power modules. Flux plots are used to diagnose the thermal problems of existing designs and to give credence to the superiority of the novel designs. The designs presented here make better thermal use of the materials in the power module stack to achieve better performance
Keywords :
design engineering; heat sinks; integrated circuit packaging; power integrated circuits; thermal analysis; designs; flux plots; packaging technologies; performance; power modules; thermal diagnoses; Bonding; Ceramics; Copper; Dielectric substrates; Ink; Isolation technology; Lead; Multichip modules; Thermal conductivity; Thick films;
Conference_Titel :
Industry Applications Conference, 1995. Thirtieth IAS Annual Meeting, IAS '95., Conference Record of the 1995 IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3008-0
DOI :
10.1109/IAS.1995.530395
