Title :
Efficient two-level mesh based simulation of PRAMS
Author :
Forsell, Martti ; Leppanen, Ville ; Penttonen, Martti
Author_Institution :
Dept. of Comput. Sci., Joensuu Univ., Finland
Abstract :
We consider time-processor optimal simulations of PRAM models on coated block meshes. A coated block mesh consists of n-processor blocks and π×π or √(π)×√(π)×√(π) router blocks. The router blocks form a 2-dimensional or a 3-dimensional regular mesh, and the processor and memory blocks are located on the surface of the block mesh. As a generalization of the coated mesh, the 2-dimensional and 3-dimensional coated block meshes simulate EREW, CREW, and CRCW PRAM models time-processor optimally with moderate simulation cost. Using proper amount of parallel slackness, the cost can be decreased clearly below 2 routing steps per simulated PRAM processor. The coated block mesh is actually an instance of a more general two-level construction technique, which uses a seemingly inefficient but scalable solution on top of a non-scalable but efficient solution. Within blocks (chips) brute force techniques are applied, whereas the mesh structure on top makes the whole construction modular, simple, and scalable. The parameter π provides a method to balance the construction with respect to the two techniques. Keywords: PRAM, shared memory machine, simulation, time-processor optimal, mesh, interconnection network
Keywords :
computational complexity; digital simulation; multiprocessor interconnection networks; parallel algorithms; random-access storage; shared memory systems; CRCW PRAM models; CREW; EREW; PRAMS; brute force techniques; coated block meshes; mesh structure; n-processor blocks; regular mesh; router blocks; time-processor optimal simulations; two-level mesh based simulation; Costs; Hardware; Hypercubes; Machinery; Neural networks; Phase change random access memory; Routing; Scalability; Sparse matrices; Yarn;
Conference_Titel :
Parallel Architectures, Algorithms, and Networks, 1996. Proceedings., Second International Symposium on
Conference_Location :
Beijing
Print_ISBN :
0-8186-7460-1
DOI :
10.1109/ISPAN.1996.508957