Title :
Multiband RF-interconnect for CMP inter-core communications
Author :
Chang, M. C Frank
Author_Institution :
Electr. Eng. Dept., Univ. of California, Los Angeles, CA, USA
Abstract :
In this paper, we propose a novel on-chip global interconnect that would meet stringent challenges of core-to-core communications in data rate (up to 100 Gbps /link), latency and re-configurability for future chip-microprocessors (CMP) with efficient area and energy overheads. We discuss the limitations of traditional RC-limited interconnects and possible benefits of multi-band RF-interconnect (RF-I) through on-chip differential transmission lines. The physical implementation of RF-I and its projected performance versus overhead as the function of CMOS technology scaling are addressed as well.
Keywords :
CMOS integrated circuits; integrated circuit interconnections; microprocessor chips; radiofrequency integrated circuits; CMOS technology; CMP inter-core communications; RC-limited interconnects; core-to-core communications; energy overheads; microprocessor chip; multiband RF-interconnect; on-chip differential transmission lines; Bandwidth; CMOS process; Delay; Dielectric substrates; Distributed parameter circuits; Frequency; Network-on-a-chip; Power transmission lines; Silicon; Wire;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
DOI :
10.1109/ICSICT.2008.4734915