• DocumentCode
    2152700
  • Title

    Improvement of kink-free operation in InGaAs/GaAs/AlGaAs high power, ridge waveguide laser diodes

  • Author

    Buda, M. ; Tan, H.H. ; Fu, L. ; Josyula, L. ; Jagadish, C.

  • Author_Institution
    Dept. of Electron. Mater. Eng., Australian Nat. Univ., Canberra, ACT, Australia
  • fYear
    2002
  • fDate
    11-13 Dec. 2002
  • Firstpage
    25
  • Lastpage
    28
  • Abstract
    This paper demonstrates the improvement of kink-free operation in InGaAs/GaAs/AlGaAs high power, ridge waveguide laser diodes. Results show that when the thickness of the insulator layer is reduced below 200 nm and Ti/Pt/Au is used as the p-type metallization, significant absorption outside the ridge occurs as a result of the penetration of the vertical optical field into the absorptive metal layers. This effect can be used to introduce selective loss for the first order lateral mode. Hence, this study has shown that the kink-free operation can be improved by 30 to 50% in 980 nm emitting laser diodes when the thickness of the SiO2 insulator is reduced to 50 to 75 nm.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium arsenide; gallium compounds; gold; indium compounds; insulating materials; integrated optics; laser modes; optical losses; optical waveguide theory; p-n heterojunctions; platinum; ridge waveguides; semiconductor device metallisation; semiconductor lasers; silicon compounds; titanium; waveguide lasers; 50 to 75 nm; 980 nm; InGaAs-GaAs-AlGaAs; SiO2; Ti-Pt-Au; absorption; absorptive metal layers; first order lateral mode; high power laser diodes; insulator layer; kink-free operation; p-type metallization; ridge waveguide laser diodes; selective loss; vertical optical field; Absorption; Diode lasers; Gallium arsenide; Gold; Indium gallium arsenide; Insulation; Metal-insulator structures; Metallization; Optical waveguides; Stimulated emission;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optoelectronic and Microelectronic Materials and Devices, 2002 Conference on
  • ISSN
    1097-2137
  • Print_ISBN
    0-7803-7571-8
  • Type

    conf

  • DOI
    10.1109/COMMAD.2002.1237180
  • Filename
    1237180