Title :
13th IEEE Workshop on signal propagation on interconnects
Abstract :
The following topic are dealt with: electronic packaging; integrated circuit interconnection; linear macromodelling; and power integrity.
Keywords :
electronics packaging; integrated circuit interconnections; electronic packaging; integrated circuit interconnection; linear macromodelling; power integrity;
Conference_Titel :
Signal Propagation on Interconnects, 2009. SPI '09. IEEE Workshop on
Conference_Location :
Strasbourg
Print_ISBN :
978-1-4244-4490-8
DOI :
10.1109/SPI.2009.5089833
