Development of a conception methodology for power multi rectifier chips module

Many industrial applications require a higher power to volume ratio. Manufacturers have achieved switch functions composed of semiconductor chips connected in parallel within power modules. Therefore, we have developed a 3D electrothermal simulation tool which solves the heat conduction equation in stationary condition, and the electrical linear system of the parallel connection which takes into account the thermal behaviour of each chip. Thus, we are able to study some electrical and thermal imbalances of the power multi-chips module, and to contribute to a safe and reliable concept. This paper deals with the case of rectifier modules