Title :
SPI proceedings: Investigation of the interactions between vias and the power-bus
Author :
Heinrich, Gerd ; Dickmann, Stefan
Author_Institution :
Univ. der Bundeswehr Hamburg, Hamburg
Abstract :
Physics-based models are widely used for the description of vias in multilayer PCBs. In this paper, such a lumped model for a via in a 4-layer PCB and the extraction of its elements are described. Furthermore, the undesired interactions between the via and the power-bus in a 4-layer PCB are investigated using the calculation of a combined lumped model and measurements of S-parameters.
Keywords :
S-parameters; printed circuits; S-parameters; lumped model; multilayer PCBs; physics-based models; power-bus; printed circuit board;
Conference_Titel :
Signal Propagation on Interconnects, 2009. SPI '09. IEEE Workshop on
Conference_Location :
Strasbourg
Print_ISBN :
978-1-4244-4490-8
Electronic_ISBN :
978-1-4244-4489-2
DOI :
10.1109/SPI.2009.5089841
