DocumentCode :
2153415
Title :
Signal integrity analysis of carbon nanotube on-chip interconnects
Author :
Chiariello, A.G. ; Maffucci, A. ; Miano, G.
Author_Institution :
DIEL, Univ. di Napoli Federico II, Naples
fYear :
2009
fDate :
12-15 May 2009
Firstpage :
1
Lastpage :
4
Abstract :
The paper deals with the signal integrity performances of a nanoscale on-chip interconnect made by using the carbon nanotube technology. As conventional copper does, this material can be used for fabricating both horizontal traces and vertical vias. Carbon nanotubes interconnects outperform copper ones in terms of electrical, thermal and mechanical properties. However their inductance is much higher compared to that of conventional material, due to inertial effects. Usually this inductance is neglected in the circuit equivalent representation of carbon nanotube interconnects. Here we use a recently proposed circuit model to study the effects of the inductance on the signal integrity. The analysis is carried out by referring to a realistic configuration foreseen for the future 22 nm technology.
Keywords :
carbon nanotubes; integrated circuit interconnections; nanotube devices; carbon nanotube on-chip interconnects; carbon nanotube technology; horizontal traces; signal integrity analysis; size 22 mm; vertical vias; Carbon nanotubes; Conductivity; Copper; Current density; Frequency; Inductance; Integrated circuit interconnections; Kinetic theory; Signal analysis; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 2009. SPI '09. IEEE Workshop on
Conference_Location :
Strasbourg
Print_ISBN :
978-1-4244-4490-8
Electronic_ISBN :
978-1-4244-4489-2
Type :
conf
DOI :
10.1109/SPI.2009.5089842
Filename :
5089842
Link To Document :
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