Title :
New intelligent power module for electric vehicles
Author :
Nakajima, Toshihiro ; Yoshida, Shigekazu ; Uenishi, Akio ; Shirasawa, Takaaki ; Ukita, Susumu ; Kimura, Yoshio
Author_Institution :
Mitsubishi Electr. Corp., Fukuoka City, Japan
Abstract :
A new intelligent power module (IPM) of 450 A, 600 V has been developed. There are three major aspects in IPM development: IGBT (insulated gate bipolar transistor) device technology, packaging technology, and intelligent driver and protection circuits technology. The IGBT device has low power loss and high switching speed. The packaging has a smart housing with special easy-to-use connectors and high density mounting. The developed circuits constitute a three phase inverter bridge, driver and three protection functions (short-circuit, over-temperature, and control supply under-voltage lock) in addition to a serially-coded fault output function. Furthermore, reliability and cost are important factors for electric vehicles. This paper describes the structure and the superior electric characteristics of the new IPM
Keywords :
PWM invertors; automotive electronics; bipolar transistor switches; driver circuits; electric vehicles; insulated gate bipolar transistors; overvoltage protection; power bipolar transistors; power field effect transistors; power semiconductor switches; protection; semiconductor device packaging; 450 A; 600 V; IGBT; control supply under-voltage lock protection; cost; electric vehicles; high density mounting; high switching speed; insulated gate bipolar transistor; intelligent driver circuit; intelligent power module; intelligent protection circuitry; low power loss; over-temperature protection; packaging; protection circuits technology; reliability; serially-coded fault output function; short-circuit protection; three phase inverter bridge; Bridge circuits; Connectors; Driver circuits; Electric vehicles; Insulated gate bipolar transistors; Intelligent vehicles; Inverters; Multichip modules; Packaging; Protection;
Conference_Titel :
Industry Applications Conference, 1995. Thirtieth IAS Annual Meeting, IAS '95., Conference Record of the 1995 IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3008-0
DOI :
10.1109/IAS.1995.530403