DocumentCode
2153825
Title
Microsystems by Bulk Micromachining
Author
Esashi, M.
Author_Institution
New Industry Creation Hatchery Center, Tohoku University, Sendai, 980-8579, Japan, esashi@cc.mech.tohoku.ac.jp
fYear
2000
fDate
Oct. 2000
Firstpage
1
Lastpage
4
Abstract
Deep RIE (Reactive Ion Etching) was developed not only for silicon but also for other materials and silicon microstructures made by the deep RIE was used as molds for making ceramic microstructures. Packaged micro mechanical sensors as pressure sensors and electrostatically levitating micro motors for gyroscope have been developed. Microprobes are fabricated for future data storage devices. Energy dissipation of resonating thin cantilever was studied for large Q factor required for highly sensitive resonating sensors. Active catheters which move like snakes in blood vessel and sensors for the catheter have been studied for the purpose of minimal invasive medicine.
Keywords
Catheters; Ceramics; Etching; Gyroscopes; Mechanical sensors; Micromachining; Micromotors; Microstructure; Packaging; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2000. 30th European
Conference_Location
Paris, France
Type
conf
DOI
10.1109/EUMA.2000.338707
Filename
4139720
Link To Document