• DocumentCode
    2153825
  • Title

    Microsystems by Bulk Micromachining

  • Author

    Esashi, M.

  • Author_Institution
    New Industry Creation Hatchery Center, Tohoku University, Sendai, 980-8579, Japan, esashi@cc.mech.tohoku.ac.jp
  • fYear
    2000
  • fDate
    Oct. 2000
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Deep RIE (Reactive Ion Etching) was developed not only for silicon but also for other materials and silicon microstructures made by the deep RIE was used as molds for making ceramic microstructures. Packaged micro mechanical sensors as pressure sensors and electrostatically levitating micro motors for gyroscope have been developed. Microprobes are fabricated for future data storage devices. Energy dissipation of resonating thin cantilever was studied for large Q factor required for highly sensitive resonating sensors. Active catheters which move like snakes in blood vessel and sensors for the catheter have been studied for the purpose of minimal invasive medicine.
  • Keywords
    Catheters; Ceramics; Etching; Gyroscopes; Mechanical sensors; Micromachining; Micromotors; Microstructure; Packaging; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2000. 30th European
  • Conference_Location
    Paris, France
  • Type

    conf

  • DOI
    10.1109/EUMA.2000.338707
  • Filename
    4139720