• DocumentCode
    2153880
  • Title

    A 5 volt high density poly-poly erase flash EPROM cell

  • Author

    Kazerounian, R. ; Ali, Shady ; Ma, Y. ; Eitan, B.

  • Author_Institution
    Waferscale Integration, Inc., Fremont, CA, USA
  • fYear
    1988
  • fDate
    11-14 Dec. 1988
  • Firstpage
    436
  • Lastpage
    439
  • Abstract
    A 5-V-only flash EPROM (erasable programmable read-only memory) cell is described which is programmed by channel-hot-electron injection and erased through a poly-poly oxide. The cell consists of a self-aligned split-gate EPROM and a polysilicon erase line. A charge-pumping technique which takes advantage of very low programming current is used to ensure fast programming at a worst case condition of 125 degrees C and 4.5-V supply. An over-erase technique is used to achieve a uniform erase, high read current, and extended endurance. The flash cell is implemented in a staggered virtual ground-array which yields a cell size of 18 mu m with 1.2- mu m design rules in a double-poly CMOS EPROM process.<>
  • Keywords
    CMOS integrated circuits; PROM; VLSI; integrated circuit technology; integrated memory circuits; 1.2 micron; 125 C; 18 micron; 4.5 V; 5 V; 5-V-only; cell size; charge-pumping technique; design rules; double-poly CMOS EPROM process; erasable programmable read-only memory; extended endurance; fast programming; flash EPROM cell; flash cell; high density; high read current; low programming current; over-erase technique; poly-poly erase; poly-poly oxide; polysilicon erase line; programmed by channel-hot-electron injection; self-aligned split-gate EPROM; staggered virtual ground-array; uniform erase; worst case condition; CMOS process; Channel hot electron injection; Charge pumps; Circuits; Costs; EPROM; Nonvolatile memory; Secondary generated hot electron injection; Split gate flash memory cells; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.1988.32849
  • Filename
    32849