• DocumentCode
    2154197
  • Title

    Measurement and simulation correlation of backplane serdes channel

  • Author

    Qu, Pingyu

  • Author_Institution
    Alcatel-Lucent Canada Ltd., Ottawa, ON
  • fYear
    2009
  • fDate
    12-15 May 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Serial data link has been widely used in telecom industry. The ability to accurately predict serdes channel insertion loss and return loss plays a critical role in prediction of serdes link performance. In a recent project we designed some test cards with the objective to characterize backplane serdes channel and conduct measurement to simulation correlation. The first part of the study is to try to correlate differential insertion loss (phase and amplitude) of 2D transmission lines between measurement and simulation. A wide band W element model extracted with Simbeor is verified and used in subsequent simulation. In the second part of the study, a full backplane serdes channel consists of daughter cards, backplane, connectors, vias, SMA launches is simulated and compared with TDR measurement. Each element is represented by a S parameter black box and cascaded together with verified W element model for PCB trace. Care must be taken when dealing with cascaded S parameter boxes in time domain simulation. Reasonable agreement is achieved on TDR/TDT signature, differential insertion loss and return loss. The final verification is an eye diagram simulation using real serdes device silicon model and compare eye diagram simulation based on measured s4p and that from S parameter model. In this paper, we presented the methodology and flow that was adopted in this study.
  • Keywords
    S-parameters; printed circuits; transmission lines; 2D transmission lines; PCB trace; S parameter black box; backplane serdes channel insertion loss; differential insertion loss; differential insertion-return loss; eye diagram simulation; measurement-simulation correlation; serial data link; telecom industry; Backplanes; Communication industry; Insertion loss; Performance loss; Propagation losses; Scattering parameters; Signal analysis; Telecommunications; Testing; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2009. SPI '09. IEEE Workshop on
  • Conference_Location
    Strasbourg
  • Print_ISBN
    978-1-4244-4490-8
  • Electronic_ISBN
    978-1-4244-4489-2
  • Type

    conf

  • DOI
    10.1109/SPI.2009.5089870
  • Filename
    5089870