Title :
Design to reliability shielded vertical interconnection applied to microwave Chip Scale Packaging
Author :
Monfraix, P. ; Adam, T. ; Lacoste, J.L. ; Drevon, C. ; Naudy, G. ; Cogo, B. ; Cazaux, J.L. ; Roux, J.L.
Author_Institution :
ALCATEL SPACE INDUSTRIES, 26 avenue J.F. CHAMPOLLION, 31037 TOULOUSE CEDEX, France. Tel: +33 (0)5 34 35 60 70, Fax: +33 (0)5 34 35 69-47, E-mail: Philippe.Monfraix@space.alcatel.fr
Abstract :
This paper presents the electrical design, measurement and reliability tests of a shielded vertical interconnection dedicated to microwave solder-mount packages. Electromagnetic simulations show very good results up to 20 GHz. Test samples have been designed and manufactured. Electrical results are in accordance with the simulations with insertion loss lower than 0.1 dB up to 20 GHz for the proposed interconnection. Reliability tests of present no degradation of the after 500 thermal cycles in the [¿55°C, +125°C] temperature range.
Keywords :
Chip scale packaging; Electric variables measurement; Electromagnetic measurements; Electromagnetic shielding; Insertion loss; Manufacturing; Microwave measurements; Semiconductor device measurement; Testing; Thermal degradation;
Conference_Titel :
Microwave Conference, 2000. 30th European
Conference_Location :
Paris, France
DOI :
10.1109/EUMA.2000.338747
