Title :
The effect of implantation damage on arsenic/phosphorus codiffusion
Author :
Law, M.E. ; Pfiester, J.R. ; Dutton, R.W.
Author_Institution :
Integrated Circuit Lab., Stanford Univ., CA, USA
Abstract :
Experiments and simulations have been performed which indicate three important effects of implantation damage on arsenic-phosphorus codiffusion. First, the profiles are primarily determined by the damage-induced injection of defects. Second, damage enhancement is independent of anneal time. Third, the effect of the damage from the phosphorus implant is as important as the arsenic implant damage. It is concluded that the modeling of these effects is critical for accurate LDD (lightly doped drain) device design.<>
Keywords :
annealing; elemental semiconductors; ion implantation; silicon; LDD device design; anneal time; damage enhancement; damage-induced injection of defects; effects of implantation damage; lightly doped drain; Annealing; Equations; Fabrication; Impurities; Kinetic theory; Laboratories; MOS devices; Modems; Oxidation; Temperature;
Conference_Titel :
Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
DOI :
10.1109/IEDM.1988.32895