Title :
BCDRouter: Global routing considering CMP and via reduction
Author :
Liang, Jinghong ; Hong, Xianlong ; Jing, Tong
Author_Institution :
Comput. Sci. & Technol. Dept., Tsinghua Univ., Beijing, China
Abstract :
Chemical-mechanical polishing (CMP) is one of the fundamental problems that should be considered for improving design for manufacturability (DFM) in routing. This paper presents a global routing algorithm, which is BCDRouter, to consider CMP. The algorithm uses the routing density of GRC to simulate the density of CMP, and reduces routing and congestion densities simultaneously. This will make the continuous CMP plainer. So that DFM, reliability and yield can be improved. The experimental results show that the algorithm is effective in reducing maximum GRC congestion and congestion variance.
Keywords :
chemical mechanical polishing; network routing; reduction (chemical); BCDRouter; CMP; chemical-mechanical polishing; global routing; reliability; via reduction; Algorithm design and analysis; Chemical technology; Design for manufacture; Minimization; Routing; Semiconductor device manufacture; System-on-a-chip; Transistors; Ultra large scale integration; Wire;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
DOI :
10.1109/ICSICT.2008.4735026