Title :
A high power density TaN/Au T-gate pHEMT with high humidity resistance for Ka-Band applications
Author :
Amasuga, Hirotaka ; Goto, Seiki ; Shiga, Toshihiko ; Totsuka, Masahiro ; Kunii, Tetsuo ; Oku, Tomoki ; Ishikawa, Takahide ; Matsuda, Yoshio
Author_Institution :
High Frequency & Opt. Semicond. Works, Mitsubishi Electr. Corp., Hyogo, Japan
Abstract :
A 0.8 W/mm high power pHEMT with high humidity resistance is reported. By using tantalum nitride as the refractory gate metal and a silicon nitride layer prepared by a catalytic chemical vapor deposition technique for passivation of this transistor, tough moisture resistance was obtained showing no Id degradation even after 500 hours at 130 degrees centigrade and 85% humidity. Moreover, the Schottky breakdown voltage of the TaN gate is higher than that of a WSiN gate. A one-stage prematched amplifier with the new pHEMT has achieved 0.83 W/mm output power at Vds = 8 V, with 8.5 dB gain and 40% power added efficiency in the Ka-band. These are some of the highest power figures ever reported.
Keywords :
chemical vapour deposition; field effect MMIC; gold compounds; passivation; power HEMT; power integrated circuits; semiconductor device breakdown; tantalum compounds; 130 C; 40 percent; 500 hours; 8 V; 8.5 dB; Ka-Band applications; Schottky breakdown voltage; T-gate pHEMT; TaN-Au; catalytic chemical vapor deposition; high power pHEMT; humidity resistance; millimeter wave power FET amplifiers; moisture resistance; passivation; prematched amplifier; refractory gate metal; semiconductor device fabrication; Chemical vapor deposition; Degradation; Gold; Humidity; Moisture; PHEMTs; Passivation; Power amplifiers; Power generation; Silicon;
Conference_Titel :
Microwave Symposium Digest, 2005 IEEE MTT-S International
Print_ISBN :
0-7803-8845-3
DOI :
10.1109/MWSYM.2005.1516745