• DocumentCode
    2155275
  • Title

    IC-processed electrostatic micro-motors

  • Author

    Long-Sheng Fan ; Yu-Chong Tai ; Muller, R.S.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
  • fYear
    1988
  • fDate
    11-14 Dec. 1988
  • Firstpage
    666
  • Lastpage
    669
  • Abstract
    The authors describe the design, fabrication, and operation of several micromotors that have been produced using integrated-circuit processing. Both rotors and stators for these motors, which are driven by electrostatic forces, are formed from 1.0-1.5- mu m-thick polycrystalline silicon. The diameters of the rotors in the motors tested are between 60 and 120 mu m. Motors with several friction-reducing designs have been fabricated using phosphosilicate glass (PSG) as a sacrificial material and either one or three polysilicon depositions. Examples of stepping and three-phase synchronous drive micromotors are described. Typical drive voltages for present designs exceed 100 V. Manually switched motors have tested at speeds up to 12 r.p.m. Synchronous motors have been driven at speeds to 500 r.p.m.<>
  • Keywords
    electrostatic devices; integrated circuit technology; monolithic integrated circuits; small electric machines; stepping motors; synchronous motors; 1 to 1.5 micron; 100 V; 60 to 120 micron; P2O5-SiO2; PSG; design; diameters; drive voltages; electrostatic micro-motors; electrostatic motors; fabrication; friction-reducing designs; integrated-circuit processing; micromotors; operation; phosphosilicate glass; polycrystalline Si; rotors; stators; stepping motors; synchronous motors; three-phase synchronous drive micromotors; Electrostatics; Fabrication; Glass; Micromotors; Rotors; Silicon; Stators; Synchronous motors; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.1988.32901
  • Filename
    32901