Lithography friendly routing: From construct-by-correction to correct-by-construction

Author

Pan, David Z. ; Cho, Minsik ; Yuan, Kun ; Ban, Yongchan

Author_Institution

Dept. of ECE, Univ. of Texas at Austin, Austin, TX, USA

fYear

2008

fDate

20-23 Oct. 2008

Firstpage

2232

Lastpage

2235

Abstract

Deep sub-wavelength lithography, i.e., using the 193 nm lithography to print 45 nm, 32 nm, and possibly 22 nm integrated circuits, is one of the most fundamental limitations for the continuous CMOS scaling. Lithography printability is strongly layout dependent, thus routing plays an important role in addressing the overall circuit manufacturability and product yield since it is the last major physical design step before tape out. This paper will discuss some recent advancement of lithography friendly routing from post-routing hotspot fixing (construct- by-correction) to during-routing hotspot avoidance (correct-by- construction) guided by various lithography metrics. We will compare these approaches, and show how to combine them. We will also discuss the emerging research needs in lithography friendly routing, such as double patterning lithography and next-generation-lithography.

Keywords

CMOS integrated circuits; integrated circuit design; lithography; network routing; construct-by-correction; continuous CMOS scaling; correct-by-construction; deep sub-wavelength lithography; double patterning lithography; lithography friendly routing; lithography printability; overall circuit manufacturability; post-routing hotspot fixing; size 193 nm; size 22 nm; size 32 nm; size 45 nm; Central Processing Unit; Lithography; Logic design; Manufacturing industries; Optical noise; Photonic integrated circuits; Routing; Runtime; Timing; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-2185-5

Electronic_ISBN

978-1-4244-2186-2

Type

conf

DOI

10.1109/ICSICT.2008.4735031

Filename

4735031