DocumentCode
2155626
Title
Analysis of RLC interconnect delay considering thermal effect
Author
Dong, Gang ; Leng, Peng ; Yang, Yintang ; Chai, Changchun
Author_Institution
Inst. of Microelectron., Xidian Univ., Xi´´an, China
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
2256
Lastpage
2259
Abstract
Based on the equivalent Elmore delay model, a new delay model that takes inductance and thermal effect into consideration is presented in this paper. The proposed model with high efficiency has closed-form expression. Its solution exhibits high accuracy as compared to the other models. Simulation results show that the error in the propagation delay is less than 10% for RLC tree example.
Keywords
RLC circuits; delay circuits; delays; equivalent circuits; inductance; interconnections; network analysis; trees (mathematics); RLC tree; equivalent Elmore delay model; inductance; interconnect delay; thermal effect; Closed-form solution; Delay effects; Equations; Inductance; Integrated circuit interconnections; Space heating; Temperature; Thermal conductivity; Thermal management; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4735040
Filename
4735040
Link To Document