• DocumentCode
    2155735
  • Title

    Design and characterization of electronic sensing system for a 13 × 13 biomechanical ground reaction sensor array

  • Author

    Guo, Qinglai ; Suster, Michael A. ; Surapaneni, R. ; Mastrangelo, Carlos H. ; Young, Douglas J.

  • Author_Institution
    Electr. & Comput. Eng. Dept., Univ. of Utah, Salt Lake City, UT, USA
  • fYear
    2013
  • fDate
    22-25 Sept. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents the design and characterization of an electronic sensing system interfaced with a high-density flexible biomechanical ground reaction sensor array (GRSA). The prototype system can be incorporated into a personal boot heel to measure real-time ground force shear strain and sole deformation associated with a human bipedal locomotion thus providing zero-velocity correction to an inertial measurement unit placed in a close proximity. This approach can greatly reduce inertial error accumulation over time and improve positioning accuracy. The electronic sensing system consists of a front-end multiplexer that can sequentially connect individual capacitive sensing nodes from a 13 × 13 GRSA to a capacitance-to-voltage converter followed by a 12-bit ADC sampled at 66.7 k-samples/sec a digital timing & control unit and a driving circuitry. The electronics were fabricated in XFAB 0.35 μm CMOS process and can achieve a gait ground velocity sensing resolution of 40 μm/sec while dissipating 3mW power.
  • Keywords
    CMOS integrated circuits; analogue-digital conversion; biomechanics; biosensors; capacitive sensors; force measurement; strain measurement; ADC; CMOS process; capacitance-to-voltage converter; capacitive sensing nodes; control unit; digital timing unit; driving circuitry; electronic sensing system; front-end multiplexer; gait ground velocity sensing resolution; high-density flexible biomechanical ground reaction sensor array; human bipedal locomotion; inertial error accumulation; inertial measurement unit; personal boot heel; positioning accuracy; power 3 mW; real-time ground force shear strain; size 0.35 mum; sole deformation; word length 12 bit; zero-velocity correction; Accuracy; Arrays; Capacitance; Force; Noise; Prototypes; Sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference (CICC), 2013 IEEE
  • Conference_Location
    San Jose, CA
  • Type

    conf

  • DOI
    10.1109/CICC.2013.6658448
  • Filename
    6658448