Title :
A novel 2-D wind sensor with thermal feedback
Author :
Shen, Guang-Ping ; Qin, Ming ; Dong, Ziqiang ; Huang, Qing-An
Author_Institution :
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China
Abstract :
The design and fabrication of a novel 2-D wind sensor as well as the interface circuits and test results were presented in this paper. A novel constant temperature difference (CTD) mode control circuits with thermal feedback was proposed, and full bridge circuits were used for wind measurement. It was fabricated on the ceramic substrate, and direct chip attach (DCA) packaged to the substrate. The wind tunnel test results show that the wind sensor can measure wind speeds up to 35 m/s with an accuracy of 0.3 m/s, and wind direction in a full range of 360° with a resolution within 5°.
Keywords :
atmospheric techniques; bridge circuits; chip scale packaging; thermal analysis; velocity measurement; wind; wind tunnels; 2D wind sensor; ceramic substrate; constant temperature difference mode control circuits; direct chip attach packaging; full bridge circuits; interface circuits; thermal feedback; wind measurement; wind speed measurement; wind tunnel test; Bridge circuits; Ceramics; Circuit testing; Fabrication; Feedback circuits; Packaging; Semiconductor device measurement; Temperature control; Temperature sensors; Thermal sensors;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
DOI :
10.1109/ICSICT.2008.4735054
